Speaker：Dr. HUANG Qiang
Time: Monday,10:00a.m.,24th August
Place:F606 SINANO
Abstract：As the microprocessor continues to scale, the critical dimensions of the state-of-the-art interconnect structures fall well below 50 nm. While Cu electrodeposition has been the process of choice since the 90 nm technology started more than 15 years ago, it currently faces significant challenges in forming these tiny structures defect free and meeting the electrical performance specs. In an effort to find the best plating chemistry for the new technology, better understanding of the relationship between the additive chemistry and performance is demanded. The first part of this talk will showcase the recent effort to develop a prescreening process that predicts the filling performance of additives based on their electrochemical behavior. The relationship between the plating chemistry, nanoscale geometry, and the impurity incorporation in the Cu lines are also studied to address the resistivity and reliability challenges that the technology currently faces. The second part of the talk will focus on the application of electrodeposition on solar energy applications. The discussion will include the metallization of silicon solar cells and the development of chalcopyrite thin film solar cell.
Bio：Dr. Qiang Huang is currently a Research Staff Member at IBM T.J. Watson Research Center, Yorktown Heights, NY. He obtained his Bachelor degree in Chemical Engineering from Zhejiang University in 1997 and his PhD degree in Chemical Engineering from Louisiana State University in 2004. He joined IBM T.J. Watson Research Center afterwards as a postdoctoral researcher in 2004 and as a Research Staff Member in 2006. His research has been focused on electrochemical technologies for semiconductor devices applications, including Cu interconnect technology, silicon and chalcopyrite thin film solar cells, magnetic and spintronic devices, semiconductor nanowires, phase change memory, and wearable electronic devices. He has authored and coauthored more than 30 peer review publications, more than 20 US patents and additional 20+ US patent applications. He has won the IBM research division award in 2013 and IBM outstanding technical award in 2014.
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