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Lecture of "Advances in Ferrite Design, Processing, and Packaging Towards Microwave Integrated Circuit Components"
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Update time: 2011-07-22
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Lecture of "Advances in Ferrite Design, Processing, and Packaging Towards Microwave Integrated Circuit Components"

 

 TOPIC:

 

Advances in Ferrite Design, Processing, and Packaging Towards Microwave Integrated Circuit Components

 

 LECTURER:

 

Prof. CHEN Yajie 陈亚杰教授

Professor of Northeastern University, USA

 

 TIME:

 

15:00, 22 July 2011 (Friday)

 

 LOCATION:

 

Room A722, SINANO

 ABSTRACT:

Ferrite materials have long played an important role in power conditioning, conversion, and generation across a wide spectrum of frequencies. They remain the preferred magnetic materials, having suitably low losses and high permeability, for most applications above 1 MHz, and are the only viable material for magnetic microwave and millimeter wave devices.

 

Recently, novel processing techniques have lead to a resurgence of interest in the design and processing of ferrite materials. These latest developments have set the stage for their innovative use in monolithic microwave integrated circuits (MMIC), magnetodielectric composite structures and substrates. Recent developments point to cost-effective, miniature, and passive components for next generation rf, microwave, and mm-wave systems.

 

In this presentation, I will explore recent advances in the design, processing, and application of ferrite materials as nanoparticles, nanocomposites, films, single crystals and bulks. Finally, I will introduce advances in multiferroic heterostructures and their impact to microwave device design.

 

 

 

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